Currently browsing: Items authored or edited by Jan Kowal https://orcid.org/0000-0001-7119-3434

Araujo de Oliveira, J.; Kowal, J.; Gungor, S. and Fitzpatrick, M. E. (2015). Determination of normal and shear residual stresses from fracture surface mismatch. Materials & Design, 83(C) pp. 176–184.

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Araujo de Oliveira, Jeferson; Fitzpatrick, Michael E. and Kowal, Jan (2014). Residual stress measurements on a metal matrix composite using the contour method with brittle fracture. In: Advanced Materials Research, Trans Tech Publications, 996 pp. 349–354.

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Braithwaite, Nick; Al-Kuzee, Jafar; Lima, Paulo and Kowal, Jan (2009). Surface activation and direct bonding of semiconductor wafers. The Open University, GB 2458256.

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Endean, Mark; Goodyear, Alec; James, Jon; Kowal, Jan and Williams, Keith (2012). The philosophy and pedagogy of practical work for engineering undergraduates and the potential for online practical activities to enhance their experience - An exploratory workshop. In: EE 2012 - International Conference on Innovation, Practice and Research in Engineering Education, Conference Proceedings, Loughborough University, article no. 94845.

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Ghosh, Paheli; Ivaturi, Aruna; Bhattacharya, Debabrata; Bowen, James; Nixon, Tony; Kowal, Jan; Braithwaite, Nicholas St John and Krishnamurthy, Satheesh (2020). Efficient hole transport material formed by atmospheric pressure plasma functionalization of Spiro-OMeTAD. Materials Today Chemistry, 17, article no. 100321.

Hosseinzadeh, Foroogh; Kowal, Jan and Bouchard, Peter John (2014). Towards good practice guidelines for the contour method of residual stress measurement. Journal of Engineering (Online only).

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Kowal, J.; Nixon, T.; Aitken, N. and Braithwaite, N. St. J. (2009). Surface activation for low temperature wafer fusion bonding by radicals produced in an oxygen discharge. Sensors and Actuators A: Physical, 155(1) pp. 145–151.

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Kowal, Jan; Rogers, Tony; Nixon, Tony and Aitken, Nicholas (2006). XPS Analysis of the Dose-Dependent Interaction of UV Radiation with a Silicon Surface. In: ECS Meeting Abstracts, MA2005-01(11) p. 513.

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Kowal, Jan (1997). Timing arrangement for an air flow meter. Airflow Developments Limited, GB2311608.

Masteika, V.; Kowal, J.; Braithwaite, N. St.J. and Rogers, T. (2014). A review of hydrophilic silicon wafer bonding. ECS Journal of Solid State Science and Technology, 3(4) Q42-Q54.

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Masteika, V.; Kowal, J.; Braithwaite, N St.J and Rogers, T. (2013). The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers. Microsystem Technologies, 19(5) pp. 705–712.

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Naveed, Nida; Hosseinzadeh, Foroogh and Kowal, Jan (2013). Residual stress measurement in a stainless steel clad ferritic plate using the contour method. In: ASME 2013 Pressure Vessels and Piping Conference, 14-18 Jul 2013.

Polido Gomes, J.; Kowal, J. and Edwards, L. (2005). An electrostatic actuated micro-structure for high-cycle fatigue testing. In: Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 7-9 Jun 2005, Portland, Oregon, USA.

Rogers, T. and Kowal, J. (1995). Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors. Sensors and Actuators A: Physical, 46(1-3) pp. 113–120.