Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization. Journal of Alloys and Compounds, 487(1-2) pp. 776–780.

DOI: https://doi.org/10.1016/j.jallcom.2009.08.064

Abstract

Interfacial reactions and growth kinetics of intermetallic compound layers formed between Sn–9Zn solder and electroplated Fe–42Ni metallization were investigated after ageing at 120, 150 and 170 ◦C for up to 360 h. Experimental results show that the intermetallic compound formed at the interface was mainly δ-FeZn8.87 phase, rather than the FeSn2 phase. The reason is that the attraction between Zn and Fe is stronger than that of Sn and Fe. The growth exponent n for δ-FeZn8.87 phase was found to be about 0.5, indicating that it grew by a diffusion-controlled process. The activation energy for the growth of δ-FeZn8.87 phase was determined to be 42 kJ/mol, which is in good agreement with the reported data.

Viewing alternatives

Metrics

Public Attention

Altmetrics from Altmetric

Number of Citations

Citations from Dimensions
No digital document available to download for this item

Item Actions

Export

About