A review of hydrophilic silicon wafer bonding

Masteika, V.; Kowal, J.; Braithwaite, N. St.J. and Rogers, T. (2014). A review of hydrophilic silicon wafer bonding. ECS Journal of Solid State Science and Technology, 3(4) Q42-Q54.

DOI: https://doi.org/10.1149/2.007403jss

URL: http://jss.ecsdl.org/content/3/4/Q42

Abstract

Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer.

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About

• Item ORO ID
• 40115
• Item Type
• Journal Item
• ISSN
• 1945-7111
• Project Funding Details

• Funded Project Name	Project ID	Funding Body
  CASE studentship funded by Applied Microengineering Ltd	Not Set	EPSRC (Engineering and Physical Sciences Research Council)

• Academic Unit or School
• Faculty of Science, Technology, Engineering and Mathematics (STEM) > Physical Sciences
  Faculty of Science, Technology, Engineering and Mathematics (STEM)
  Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
• Research Group
• Physics
• Copyright Holders
• © 2014 The Electrochemical Society
• Depositing User
• Jan Kowal