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Masteika, V.; Kowal, J.; Braithwaite, N. St.J. and Rogers, T.
(2014).
DOI: https://doi.org/10.1149/2.007403jss
URL: http://jss.ecsdl.org/content/3/4/Q42
Abstract
Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer.