A review of hydrophilic silicon wafer bonding

Masteika, V.; Kowal, J.; Braithwaite, N. St.J. and Rogers, T. (2014). A review of hydrophilic silicon wafer bonding. ECS Journal of Solid State Science and Technology, 3(4) Q42-Q54.

DOI: https://doi.org/10.1149/2.007403jss

URL: http://jss.ecsdl.org/content/3/4/Q42


Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer.

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