The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers

Masteika, V.; Kowal, J.; Braithwaite, N St.J and Rogers, T. (2013). The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers. Microsystem Technologies, 19(5) pp. 705–712.

DOI: https://doi.org/10.1007/s00542-012-1685-8

Abstract

Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length bond strength measurement in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has stopped moving, and that the presence of moisture has a strong positive influence on the rate of crack propagation under static loading. A new Maszara protocol is suggested based on modelling crack growth using our experimentally derived constants.

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About

• Item ORO ID
• 35366
• Item Type
• Journal Item
• ISSN
• 1432-1858
• Project Funding Details

• Funded Project Name	Project ID	Funding Body
  Not Set	Not Set	EPSRC (Engineering and Physical Sciences Research Council)
  Not Set	Not Set	Applied Microengineering Ltd.

• Extra Information
• Manuscript number MITE-D-12-02006R2
• Keywords
• silicon; wafer bonding; humidity; crack propagation; razor blade
• Academic Unit or School
• Faculty of Science, Technology, Engineering and Mathematics (STEM) > Physical Sciences
  Faculty of Science, Technology, Engineering and Mathematics (STEM)
  Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
• Research Group
• Physics
• Copyright Holders
• © 2012 Springer
• Depositing User
• Jan Kowal