Tin pest in lead-free solders

Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J. (2001). Tin pest in lead-free solders. Soldering and Surface Mount Technology, 13(1) pp. 39–40.

DOI: https://doi.org/10.1108/09540910110361730

Abstract

Considers the effect of low temperatures on the characteristics of lead-free alloys based upon tin, which is the most popular basis for the new alloys.

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