Tin pest in lead-free solders

Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J. (2001). Tin pest in lead-free solders. Soldering and Surface Mount Technology, 13(1) pp. 39–40.

DOI: https://doi.org/10.1108/09540910110361730

Abstract

Considers the effect of low temperatures on the characteristics of lead-free alloys based upon tin, which is the most popular basis for the new alloys.

Viewing alternatives

Metrics

Item Actions

Export

You can export this page using these formats Digital Object Identifier - DOI

About

• Item ORO ID
• 12217
• Item Type
• Journal Item
• ISSN
• 0954-0911
• Keywords
• Lead-free soldering; Reliability; Tin;
• Academic Unit or School
• Faculty of Science, Technology, Engineering and Mathematics (STEM)
• Depositing User
• Colin Gagg