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Items Authored or Edited by Xinfang Zhang

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Number of items: 31.

2017

Zhang, Xinfang and Qin, Rongshan (2017). Separation of electrically neutral non-metallic inclusions from molten steel by pulsed electric current. Materials Science and Technology, 33(12) pp. 1399–1403. restricted access item, not available for direct download

2015

Lu, W. J.; Zhang, X. F. and Qin, R. S. (2015). Stability of precipitates under electropulsing in 316L stainless steel. Materials Science and Technology, 31(13a) pp. 1530–1535.

Lu, W. J.; Zhang, X. F. and Qin, R. S. (2015). Structure and properties of κ-carbides in duplex lightweight steels. Ironmaking & Steelmaking, 42(8) pp. 626–631. file

Zhang, X. F. and Qin, R. S. (2015). Segregation of copper in an Fe–Cu alloy under pulsed electric current. Philosophical Magazine Letters, 95(7) pp. 367–375. file

Zhang, Xinfang and Qin, Rongshan (2015). Controlled motion of electrically neutral microparticles by pulsed direct current. Scientific Reports, 5, article no. 10162. file

Zhang, X. F. and Qin, R. S. (2015). Preparation of surface coatings on a conductive substrate by controlled motion of graphene nanoflakes in a liquid medium. Applied Surface Science, 329 pp. 276–280.

Zhang, X. F.; Lu, W.J. and Qin, R. S. (2015). Oriented sulphides induced by electric current in medium carbon steel. Philosophical Magazine Letters, 95(2) pp. 101–109.

2014

Zhang, X. F.; Lu, W.J. and Qin, R. S. (2014). Morphology and distribution control of MnS inclusions in molten steel by electropulsing. Materials Research Innovations, 18(S4) pp. 244–248.

Qin, R. S.; Rahnama, A.; Lu, W.J.; Zhang, X. F. and Elliott-Bowman, B. (2014). Electropulsed steels. Materials Science and Technology, 30(9) pp. 1040–1044.

Zhang, Xinfang and Qin, Rongshan (2014). Electric current-driven migration of electrically neutral particles in liquids. Applied Physics Letters, 104(11), article no. 114106.

Lu, W.J.; Zhang, X. F. and Qin, R. S. (2014). Electropulsing-induced strengthening of steel at high temperature. Philosophical Magazine Letters, 94(11) pp. 688–695.

Komizo, Yu-ichi; Zhang, Xin Fang and Terasaki, Hidenori (2014). Hybrid system for in situ observation of microstructure evolution in steel materials. In: Kannengiesser, Thomas; Babu, Sudarsanam Suresh; Komizo, Yu-ichi and Ramirez, Antonio J. eds. In situ studies with photons, neutrons and electrons scattering II. Cham: Springer International Publishing Switzerland, pp. 1–26.

2013

Zhang, X. F.; Terasaki, H. and Komizo, Y. (2013). In situ observations of phase transformation during C-Mn-Al steel weld solidification. Materials Science and Technology, 29(11) pp. 1363–1372.

Zhang, X. F.; Lu, W. J. and Qin, R. S. (2013). Removal of MnS inclusions in molten steel using electropulsing. Scripta Materialia, 69(6) pp. 453–456.

Zhang, Xinfang and Komizo, Yu-ichi (2013). In situ investigation of the allotropic transformation in iron. Steel Research International, 84(8) pp. 751–760.

Zhang, X. F. and Komizo, Y. (2013). Visual analysis of solidification of δ–γ transformations in steels. Materials Science and Technology, 29(5) pp. 631–635.

Zhang, X. F. and Komizo, Y. (2013). Direct observation of thermal stability of M23C6 carbides during reheating using in situ synchrotron X-ray diffraction. Philosophical Magazine Letters, 93(1) pp. 9–17.

2012

Zhang, X. F.; Terasaki, H. and Komizo, Y. (2012). In situ observation of high temperature creep behavior during annealing of steel. Metallurgical and Materials Transactions A, 43(13) pp. 5067–5078.

Zhang, X. F.; Han, P.; Terasaki, H.; Sato, M. and Komizo, Y. (2012). Analysis investigation of prior austenite grain size dependence of low temperature toughness in steel weld metal. Journal of Materials Science &Technology, 28(3) pp. 241–248.

Zhang, X. F.; Terasaki, H. and Komizo, Y. (2012). In situ investigation of structure and stability of niobium carbonitrides in an austenitic heat-resistant steel. Scripta Materialia, 67(2) pp. 201–204.

Zhang, Xinfang; Han, Peng; Komizo, Yuichi; Sato, Munenobu and Terasaki, Hidenori (2012). Fracture toughness of high strength steel weld metals at low temperatures. In: International Welding and Joining Conference, 8-11 May, 2012, Jeju, Korea.

2011

Zhang, X. F.; Liu, H.Y.; Guo, J. D. and Shang, J. K. (2011). Inhibition of electromigration in eutectic SnBi solder interconnect by plastic prestraining. Journal of Materials Science & Technology, 27(11) pp. 1072–1076.

Zhang, X. F.; Terasaki, H. and Komizo, Y. (2011). Correlation of delta-ferrite precipitation with austenite grain growth during annealing of steels. Philosophical Magazine Letters, 91(7) pp. 491–497.

2010

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2010). Current-induced interfacial reactions of Sn solder joint with electroplated FeNi/Cu substrate. Journal of Electronic Materials, 39(3) pp. 333–337.

2009

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect. Journal of Electronic Materials, 38(3) pp. 425–429.

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition. Journal of Alloys and Compounds, 479(1-2) pp. 505–510.

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization. Journal of Alloys and Compounds, 487(1-2) pp. 776–780.

2008

Zhang, Xinfang; Guo, J.D. and Shang, J.K. (2008). A new method to inhibit the electromigration failure of solder interconnects. State Intellectual Property Office of P.R. China, CN101728286B.

Zhang, X. F.; Guo, J.D. and Shang, J.K. (2008). Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect. Journal of Materials Research, 23(12) pp. 3370–3378.

2007

Zhang, X. F. ; Guo, J. D. and Shang, J. K. (2007). Abnormal polarity effect of electromigraton on intermetallic compound formation in Sn-9Zn solder interconnect. Scripta Materialia, 57(6) pp. 513–516.

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2007). Effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect. In: Proceedings of 2007 8th International Conference on Electronics Packaging Technology, IEEE, pp. 1–4.

This list was generated on Wed Nov 22 23:01:48 2017 GMT.

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