Currently browsing: Items authored or edited by Xinfang Zhang

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Lu, W. J.; Zhang, X. F. and Qin, R. S. (2015). Stability of precipitates under electropulsing in 316L stainless steel. Materials Science and Technology, 31(13a) pp. 1530–1535.

Zhang, X. F.; Lu, W.J. and Qin, R. S. (2015). Oriented sulphides induced by electric current in medium carbon steel. Philosophical Magazine Letters, 95(2) pp. 101–109.

2014To Top

Zhang, X. F.; Lu, W.J. and Qin, R. S. (2014). Morphology and distribution control of MnS inclusions in molten steel by electropulsing. Materials Research Innovations, 18(S4) pp. 244–248.

Qin, R. S.; Rahnama, A.; Lu, W.J.; Zhang, X. F. and Elliott-Bowman, B. (2014). Electropulsed steels. Materials Science and Technology, 30(9) pp. 1040–1044.

Lu, W.J.; Zhang, X. F. and Qin, R. S. (2014). Electropulsing-induced strengthening of steel at high temperature. Philosophical Magazine Letters, 94(11) pp. 688–695.

Komizo, Yu-ichi; Zhang, Xin Fang and Terasaki, Hidenori (2014). Hybrid system for in situ observation of microstructure evolution in steel materials. In: Kannengiesser, Thomas; Babu, Sudarsanam Suresh; Komizo, Yu-ichi and Ramirez, Antonio J. eds. In situ studies with photons, neutrons and electrons scattering II. Cham: Springer International Publishing Switzerland, pp. 1–26.

2013To Top

Zhang, X. F.; Terasaki, H. and Komizo, Y. (2013). In situ observations of phase transformation during C-Mn-Al steel weld solidification. Materials Science and Technology, 29(11) pp. 1363–1372.

Zhang, X. F.; Lu, W. J. and Qin, R. S. (2013). Removal of MnS inclusions in molten steel using electropulsing. Scripta Materialia, 69(6) pp. 453–456.

Zhang, Xinfang and Komizo, Yu-ichi (2013). In situ investigation of the allotropic transformation in iron. Steel Research International, 84(8) pp. 751–760.

Zhang, X. F. and Komizo, Y. (2013). Visual analysis of solidification of δ–γ transformations in steels. Materials Science and Technology, 29(5) pp. 631–635.

2012To Top

Zhang, X. F.; Terasaki, H. and Komizo, Y. (2012). In situ observation of high temperature creep behavior during annealing of steel. Metallurgical and Materials Transactions A, 43(13) pp. 5067–5078.

Zhang, X. F.; Han, P.; Terasaki, H.; Sato, M. and Komizo, Y. (2012). Analysis investigation of prior austenite grain size dependence of low temperature toughness in steel weld metal. Journal of Materials Science &Technology, 28(3) pp. 241–248.

Zhang, Xinfang; Han, Peng; Komizo, Yuichi; Sato, Munenobu and Terasaki, Hidenori (2012). Fracture toughness of high strength steel weld metals at low temperatures. In: International Welding and Joining Conference, 8-11 May 2012, Jeju, Korea.

2011To Top

Zhang, X. F.; Liu, H.Y.; Guo, J. D. and Shang, J. K. (2011). Inhibition of electromigration in eutectic SnBi solder interconnect by plastic prestraining. Journal of Materials Science & Technology, 27(11) pp. 1072–1076.

Zhang, X. F.; Terasaki, H. and Komizo, Y. (2011). Correlation of delta-ferrite precipitation with austenite grain growth during annealing of steels. Philosophical Magazine Letters, 91(7) pp. 491–497.

2010To Top

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2010). Current-induced interfacial reactions of Sn solder joint with electroplated FeNi/Cu substrate. Journal of Electronic Materials, 39(3) pp. 333–337.

2009To Top

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect. Journal of Electronic Materials, 38(3) pp. 425–429.

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition. Journal of Alloys and Compounds, 479(1-2) pp. 505–510.

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization. Journal of Alloys and Compounds, 487(1-2) pp. 776–780.

2008To Top

Zhang, Xinfang; Guo, J.D. and Shang, J.K. (2008). A new method to inhibit the electromigration failure of solder interconnects. State Intellectual Property Office of P.R. China, CN101728286B.

Zhang, X. F.; Guo, J.D. and Shang, J.K. (2008). Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect. Journal of Materials Research, 23(12) pp. 3370–3378.

2007To Top

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2007). Effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect. In: Proceedings of 2007 8th International Conference on Electronics Packaging Technology, IEEE, pp. 1–4.

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