Currently browsing: Items authored or edited by Colin Gagg

40 items in this list.
Generated on Mon Sep 28 10:09:49 2020 BST.

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2014To Top

Gagg, Colin and Amsterdam, Emiel (2014). Special issue on ICEFA V-Part II. Engineering Failure Analysis, 41 pp. 1–134.

2013To Top

Gagg, Colin and Amsterdam, Emiel (2013). Special issue on ICEFA V- Part 1. Engineering Failure Analysis. Vol 35, Pages 1-742.

2011To Top

2010To Top

Gagg, Colin R. (2010). Failure of engineering ceramic products and structures - A case study compendium. In: Fourth International Conference on Engineering Failure Analysis (ICEFA-IV), 4-7 Jul 2010, Churchill College, Cambridge, UK.

Gagg, Colin (2010). Failure of a machine tool three jaw chuck set. In: Fourth International Conference on Engineering Failure Analysis (ICEFA-IV), 04-07 Jul 2010, Churchill College, Cambridge, UK.

2009To Top

Lewis, Peter R. and Gagg, Colin R. (2009). Failure of an epidural catheter. Engineering Failure Analysis, 16(6) pp. 1805–1815.

2008To Top

Lewis, P. R. and Gagg, C. R. (2008). Failure of Polymeric Medical Products. In: Third International Conference on Engineering Failure Analysis (ICEFA III), 13-16 Jul 2008, Sitges, Spain.

Gagg, C. R.; Lewis, P. R. and Tsang, C. (2008). Premature failure of a vacuum pump impeller rotor recovered from a pitch impregnation plant. Engineering Failure Analysis, 15(5) pp. 606–615.

Gagg, C. R. and Lewis, P. R. (2008). Service failure of rolling contact bearings - case study review. In: Third International Confrence on Engineering Failure Analysis (ICEFA III), 13-16 Jul 2008, Sitges, Barcelona, Spain.

Lewis, P. R. and Gagg, C. (2008). Component fatigue on the early railways. In: Third International Conference on Engineering Failure Analysis (ICEFA III), 13-16 Jul 2008, Sitges, Barcelona, Spain.

2007To Top

Gagg, Colin. R. and Lewis, Peter. R. (2007). Wear as a product failure mechanism – Overview and case studies. Engineering Failure Analysis, 14(8) pp. 1618–1640.

Gagg, C. R. and Lewis, P. R. (2007). Counterfeit coin of the realm – Review and case study analysis. Engineering Failure Analysis, 14(6) pp. 1144–1152.

2006To Top

Gagg, C. and Harris, D. (2006). Current status of staged road traffic accidents within the UK - case study analysis. In: Second International Conference on Engineering Failure Analysis (ICEFA II), 12-15 Sep 2006, Toronto, Canada.

Lewis, P. R. and Gagg, C. R. (2006). Post-graduate Forensic Engineering at The Open University. In: Proceedings of the International Conference on Innovation, Good Practice and Research in Engineering Education, 24-26 Jul 2006, University of Liverpool, UK.

Lewis, P. R and Gagg, C. R. (2006). Failure of a Nylon Bridge Bearing. In: ANTEC 2006 Plastics: 64th Annual Technical Conference Proceedings, May 2006, Charlotte, NC, USA.

2005To Top

Gagg, C. R. (2005). Failure of components and products by ‘engineered-in’ defects: Case studies. Engineering Failure Analysis, 12(6) pp. 1000–1026.

Gagg, Colin (2005). Domestic product failures: Case studies. Engineering Failure Analysis, 12(5) pp. 784–807.

2004To Top

Shohji, Ikuo; Gagg, Colin and Plumbridge, William J. (2004). Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy. Journal of Electronic Materials, 33(8) pp. 923–927.

Lewis, Peter. R. and Gagg, Colin. R. (2004). Aesthetics versus function: the fall of the Dee bridge, 1847. Interdisciplinary Science Reviews, 29(2) pp. 177–191.

Gagg, C. R. (2004). Failure of Stainless Steel Water Pump Couplings. In: Jones, D. R. H. ed. Failure Analysis Case Studies III. Oxford, UK: Elsevier, pp. 225–236.

2003To Top

2002To Top

Plumbridge, W. J. and Gagg, C. R. (2002). The influence of temperature on the creep of tin-37 lead solders. In: TMS Fall Meeting, 6-10 Oct 2002, Columbus Ohio, USA.

2001To Top

Plumbridge, W. J.; Gagg, C. R. and Peters, S. (2001). The creep of lead-free solders at elevated temperatures. Journal of Electronic Materials, 30(9) pp. 1178–1183.

Kariya, Yoshiharu; Williams, Naomi; Gagg, Colin and Plumbridge, William (2001). Tin pest in Sn-0.5 wt.% Cu lead-free solder. JOM Journal of the Minerals, Metals and Materials Society, 53(6) pp. 39–41.

Gagg, C. R. (2001). Failure of stainless steel water pump couplings. Engineering Failure Analysis, 8(2) pp. 189–199.

Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J. (2001). Tin pest in lead-free solders. Soldering and Surface Mount Technology, 13(1) pp. 39–40.

Plumbridge, W.; Kariya, Y. and Gagg, C. R. (2001). The influence of processing history on the creep of tin-3.5 silver alloys. In: Seventh Symposium on Microjoining and Assembly Technology in Electronics (MATE 2001), 2001, Yokohama, Japan.

2000To Top

Kariya, Y.; Gagg, C. R.; Williams, N. and Plumbridge, W. J. (2000). Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly. In: CHANNEL Users Meeting, 15-18 Jun 2000, Hobro, Denmark.

Plumbridge, W. J. and Gagg, C. R. (2000). The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge. Proceedings of the Institution of Mechanical Engineers Part L, Journal of Materials: Design and Applications, 214(3) pp. 153–161.

1999To Top

Plumbridge, W. J. and Gagg, C. R. (1999). Effects of strain rate and temperature on the stress–strain response of solder alloys. Journal of Materials Science: Materials in Electronics, 10(5-6) pp. 461–468.

1998To Top

Plumbridge, W. J.; Gagg, C. R. and Moffatt, J. (1998). Solders for the Next Millennium. In: Materials Congress; Institute of Materials, 6-8 Apr 1998, Cirencester, Wilts.

1996To Top

Gagg, Colin and Plumbridge, William (1996). The effect of ageing on the creep of a eutectic lead-tin alloy. In: British Association for Brazing and Soldering (BABS) Autumn Conference, 30-31 Oct 1996, Birmingham.

1991To Top

Weaver, G. H.; Braithwaite, N St. J. and Gagg, C. (1991). Lets make a strain gauge: a summer school laboratory activity in electronic materials. In: Smith, R. A. ed. Innovative teaching in engineering. Chichester, England: Ellis Horwood, pp. 288–292.

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