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Plumbridge, W. J. and Gagg, C. R. (1999). Effects of strain rate and temperature on the stress–strain response of solder alloys. Journal of Materials Science: Materials in Electronics, 10(5-6) pp. 461–468.

Plumbridge, W.J. (2007). Tin pest issues in lead-free electronic solders. Journal of Materials Science: Materials in Electronics, 18(1-3) pp. 307–318.

Sefton, D. E.; Rist, M. A. and Gungor, S. (2009). Rate-dependent deformation of Sn–3.5Ag lead-free solder. Journal of Materials Science: Materials in Electronics, 20(11) pp. 1083–1089.

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