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Number of items: 4.

Londos, C. A.; Sgourou, E. N.; Hall, D. and Chroneos, A. (2014). Vacancy-oxygen defects in silicon: the impact of isovalent doping. Journal of Materials Science: Materials in Electronics, 25(6) pp. 2395–2410. restricted access item, not available for direct download

Plumbridge, W. J. and Gagg, C. R. (1999). Effects of strain rate and temperature on the stress–strain response of solder alloys. Journal of Materials Science: Materials in Electronics, 10(5-6) pp. 461–468.

Plumbridge, W.J. (2007). Tin pest issues in lead-free electronic solders. Journal of Materials Science: Materials in Electronics, 18(1-3) pp. 307–318.

Sefton, D. E.; Rist, M. A. and Gungor, S. (2009). Rate-dependent deformation of Sn–3.5Ag lead-free solder. Journal of Materials Science: Materials in Electronics, 20(11) pp. 1083–1089.

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