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Number of items: 8.


Zhang, X. F.; Guo, J. D. and Shang, J. K. (2010). Current-induced interfacial reactions of Sn solder joint with electroplated FeNi/Cu substrate. Journal of Electronic Materials, 39(3) pp. 333–337.


Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect. Journal of Electronic Materials, 38(3) pp. 425–429.


Plumbridge, W. J. (2008). Recent Observations on Tin Pest Formation in Solder Alloys. Journal of Electronic Materials, 37(2) pp. 218–223.


Liu, X. W. and Plumbridge, W. J. (2007). Damage Produced in Solder Alloys during Thermal Cycling. Journal of Electronic Materials, 36(9) pp. 1111–1120.


Rist, Martin A.; Plumbridge, W.J. and Cooper, S. (2006). Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach. Journal of Electronic Materials, 35(5) pp. 1050–1058.


Shohji, Ikuo; Gagg, Colin and Plumbridge, William J. (2004). Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy. Journal of Electronic Materials, 33(8) pp. 923–927.


Liu, X.W. and Plumbridge, W.J. (2003). Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling. Journal of Electronic Materials, 32(4) pp. 278–286.


Plumbridge, W. J.; Gagg, C. R. and Peters, S. (2001). The creep of lead-free solders at elevated temperatures. Journal of Electronic Materials, 30(9) pp. 1178–1183.

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