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Group by: Published Date | Item Type | No Grouping
Jump to: 2008 | 2007 | 2006 | 2004 | 2003 | 2001
Number of items: 6.

2008

Plumbridge, W. J. (2008). Recent Observations on Tin Pest Formation in Solder Alloys. Journal of Electronic Materials, 37(2) pp. 218–223.

2007

Liu, X. W. and Plumbridge, W. J. (2007). Damage Produced in Solder Alloys during Thermal Cycling. Journal of Electronic Materials, 36(9) pp. 1111–1120.

2006

Rist, Martin A.; Plumbridge, W.J. and Cooper, S. (2006). Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach. Journal of Electronic Materials, 35(5) pp. 1050–1058.

2004

Shohji, Ikuo; Gagg, Colin and Plumbridge, William J. (2004). Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy. Journal of Electronic Materials, 33(8) pp. 923–927.

2003

Liu, X.W. and Plumbridge, W.J. (2003). Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling. Journal of Electronic Materials, 32(4) pp. 278–286.

2001

Plumbridge, W. J.; Gagg, C. R. and Peters, S. (2001). The creep of lead-free solders at elevated temperatures. Journal of Electronic Materials, 30(9) pp. 1178–1183.

This list was generated on Fri Apr 18 21:51:45 2014 BST.

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