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Number of items: 12.


Londos, C. A.; Sgourou, E. N.; Hall, D. and Chroneos, A. (2014). Vacancy-oxygen defects in silicon: the impact of isovalent doping. Journal of Materials Science: Materials in Electronics, 25(6) pp. 2395–2410. restricted access item, not available for direct download


Zhang, X. F.; Guo, J. D. and Shang, J. K. (2010). Current-induced interfacial reactions of Sn solder joint with electroplated FeNi/Cu substrate. Journal of Electronic Materials, 39(3) pp. 333–337.


Sefton, D. E.; Rist, M. A. and Gungor, S. (2009). Rate-dependent deformation of Sn–3.5Ag lead-free solder. Journal of Materials Science: Materials in Electronics, 20(11) pp. 1083–1089.

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect. Journal of Electronic Materials, 38(3) pp. 425–429.


Plumbridge, W. J. (2008). Recent Observations on Tin Pest Formation in Solder Alloys. Journal of Electronic Materials, 37(2) pp. 218–223.


Liu, X. W. and Plumbridge, W. J. (2007). Damage Produced in Solder Alloys during Thermal Cycling. Journal of Electronic Materials, 36(9) pp. 1111–1120.

Plumbridge, W.J. (2007). Tin pest issues in lead-free electronic solders. Journal of Materials Science: Materials in Electronics, 18(1-3) pp. 307–318.


Rist, Martin A.; Plumbridge, W.J. and Cooper, S. (2006). Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach. Journal of Electronic Materials, 35(5) pp. 1050–1058.


Shohji, Ikuo; Gagg, Colin and Plumbridge, William J. (2004). Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy. Journal of Electronic Materials, 33(8) pp. 923–927.


Liu, X.W. and Plumbridge, W.J. (2003). Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling. Journal of Electronic Materials, 32(4) pp. 278–286.


Plumbridge, W. J.; Gagg, C. R. and Peters, S. (2001). The creep of lead-free solders at elevated temperatures. Journal of Electronic Materials, 30(9) pp. 1178–1183.


Plumbridge, W. J. and Gagg, C. R. (1999). Effects of strain rate and temperature on the stress–strain response of solder alloys. Journal of Materials Science: Materials in Electronics, 10(5-6) pp. 461–468.

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