The Open UniversitySkip to content
 

Browse by Journal

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0 [Create Shortened URL] SURL
Group by: Published Date | Item Type | No Grouping
Jump to: 2014 | 2009 | 2008 | 2007 | 2006 | 2004 | 2003 | 2001 | 1999
Number of items: 10.

2014

Londos, C. A.; Sgourou, E. N.; Hall, D. and Chroneos, A. (2014). Vacancy-oxygen defects in silicon: the impact of isovalent doping. Journal of Materials Science: Materials in Electronics, 25(6) pp. 2395–2410. restricted access item, not available for direct download

2009

Sefton, D. E.; Rist, M. A. and Gungor, S. (2009). Rate-dependent deformation of Sn–3.5Ag lead-free solder. Journal of Materials Science: Materials in Electronics, 20(11) pp. 1083–1089.

2008

Plumbridge, W. J. (2008). Recent Observations on Tin Pest Formation in Solder Alloys. Journal of Electronic Materials, 37(2) pp. 218–223.

2007

Liu, X. W. and Plumbridge, W. J. (2007). Damage Produced in Solder Alloys during Thermal Cycling. Journal of Electronic Materials, 36(9) pp. 1111–1120.

Plumbridge, W.J. (2007). Tin pest issues in lead-free electronic solders. Journal of Materials Science: Materials in Electronics, 18(1-3) pp. 307–318.

2006

Rist, Martin A.; Plumbridge, W.J. and Cooper, S. (2006). Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach. Journal of Electronic Materials, 35(5) pp. 1050–1058.

2004

Shohji, Ikuo; Gagg, Colin and Plumbridge, William J. (2004). Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy. Journal of Electronic Materials, 33(8) pp. 923–927.

2003

Liu, X.W. and Plumbridge, W.J. (2003). Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling. Journal of Electronic Materials, 32(4) pp. 278–286.

2001

Plumbridge, W. J.; Gagg, C. R. and Peters, S. (2001). The creep of lead-free solders at elevated temperatures. Journal of Electronic Materials, 30(9) pp. 1178–1183.

1999

Plumbridge, W. J. and Gagg, C. R. (1999). Effects of strain rate and temperature on the stress–strain response of solder alloys. Journal of Materials Science: Materials in Electronics, 10(5-6) pp. 461–468.

This list was generated on Sat Oct 25 13:06:06 2014 BST.

Policies | Disclaimer

© The Open University   + 44 (0)870 333 4340   general-enquiries@open.ac.uk