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Plumbridge, W.J.
(2003).
DOI: https://doi.org/10.1108/09540910310455699
Abstract
With the continued miniaturisation of electronics equipment, a more detailed examination of the mechanical behaviour of solders is required to ensure reliability in performance. The paper reviews various aspects of the interpretation of the creep response of lead-containing and lead-free alloys. It demonstrates the necessity of acquiring stress-rupture data over as long a period as possible to avoid non-conservative extrapolation. For example, at 75°C, the transition in slope of the applied stress vs time to rupture plot occurs after about 1,000?h for Sn-37Pb, although for the lead-free alloys examined no such transition is observed within this timescale. Sometimes, deformation may be a more appropriate failure criterion than rupture, and it is shown that for Sn-37Pb this may result in substantially shorter failure times than utilising a rupture criterion. The quality of life estimation methods then depends upon the extent of this stage when the creep rate is a minimum. The Y factor (tm?:?tr) where tm is the time spent in steady state or within 10 per cent of the minimum creep rate, for all the solders examined at 75°C generally falls into the 20-30 per cent range. Estimations of creep life may substantially under predict because of this.
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About
- Item ORO ID
- 7688
- Item Type
- Journal Item
- ISSN
- 0954-0911
- Keywords
- lead-free; reliability; solder
- Academic Unit or School
- Faculty of Science, Technology, Engineering and Mathematics (STEM)
- Depositing User
- Martin Rist