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Implementing lead-free solders - the performance aspects

Plumbridge, W.J. (2006). Implementing lead-free solders - the performance aspects. Soldering and Surface Mount Technology, 18(1) pp. 11–18.

DOI (Digital Object Identifier) Link: http://dx.doi.org/10.1108/09540910610647071
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Abstract

Purpose – To draw attention to the need to consider design and performance, as well as production, in the implementation of lead-free solders.
Design/methodology/approach – The potential failure modes of solder joints and their underlying causes are reviewed. A hypothetical design exercise is employed to demonstrate key requirements for reliable design.
Findings – The substantial variation in influential mechanical properties over the ranges of stress, temperature and strain rate is likely to be encountered in service. In addition to these three parameters, there is the need to consider time-temperature profiles in the service cycle and the prior thermal history of the joint materials.
Originality/value – The demonstration that reliable design and life prediction can only be achieved by employing appropriate properties in appropriate constitutive expressions.

Item Type: Journal Article
ISSN: 0954-0911
Keywords: acceleration; failure modes; effects analysis; service operations; solders; variance
Academic Unit/Department: Mathematics, Computing and Technology > Engineering & Innovation
Item ID: 7687
Depositing User: Martin Rist
Date Deposited: 15 May 2007
Last Modified: 02 Dec 2010 19:59
URI: http://oro.open.ac.uk/id/eprint/7687
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