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Long term mechanical reliability with lead-free solders

Plumbridge, W.J. (2004). Long term mechanical reliability with lead-free solders. Soldering and Surface Mount Technology, 16(2) pp. 13–20.

DOI (Digital Object Identifier) Link: http://dx.doi.org/10.1108/09540910410537291
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Abstract

The decision to move to lead-free solders has been made, but processing and performance challenges remain. This paper considers the transition in terms of performance, with particular emphasis on long term, high reliability applications. Comparison of key mechanical properties indicates generally beneficial outcomes of the transition to lead-free alloys, although there is a lack of understanding surrounding “anomalous” observations, such as the effects of the bismuth. The lower melting point of Sn-Zn-Bi alloys, together with their comparable mechanical properties, provide further impetus to address their shortcomings during processing. Some lead-free alloys, such as Sn-0.5Cu, are susceptible to tin-pest formation following prolonged exposure below 13°C, and this possibility remains for the more concentrated Sn-3.8Ag-0.7Cu alloy.

Item Type: Journal Article
ISSN: 0954-0911
Keywords: modelling; reliability; reliability management; solders
Academic Unit/Department: Mathematics, Computing and Technology > Engineering & Innovation
Item ID: 7668
Depositing User: Martin Rist
Date Deposited: 15 May 2007
Last Modified: 02 Dec 2010 19:59
URI: http://oro.open.ac.uk/id/eprint/7668
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