Polido Gomes, J.; Kowal, J. and Edwards, L.
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Fatigue failure knowledge of polycrystalline silicon (polysilicon) thin films is crucial for the design of efficient microelectromechanical systems (MEMS). Reliability investigations of polysilicon thin films are normally conducted by subjecting a population of micron-scale fracture mechanics specimens to cyclic loading while testing in laboratory air or cvacuum conditions. The present work describes the design of two fully-integrated micromachined fatigue-characterization specimens fabricated for high-cycle fatigue testing of 2-um thick polysilicon thin films. Preliminary results were obtained from tests conducted on a 2-um resonant structure that works at fully reversed, constant amplitude stresses at a frequency of about 46 kHz. The present work permitted the characterization of the motion of the structure and calibration of the imaging system.
|Item Type:||Conference Item|
|Extra Information:||ISBN - 0-912053-90-9|
|Keywords:||MEMS; fatigue failure; polysilicon; resonant|
|Academic Unit/Department:||Mathematics, Computing and Technology > Engineering & Innovation|
|Depositing User:||Jan Kowal|
|Date Deposited:||07 Jun 2007|
|Last Modified:||02 Dec 2010 19:57|
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