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Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach

Rist, Martin A.; Plumbridge, W.J. and Cooper, S. (2006). Creep-constitutive behavior of Sn-3.8Ag-0.7Cu solder using an internal stress approach. Journal of Electronic Materials, 35(5) pp. 1050–1058.

URL: http://doc.tms.org/ezMerchant/prodtms.nsf/ProductL...
DOI (Digital Object Identifier) Link: http://dx.doi.org/10.1007/BF02692566
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Abstract

The experimental tensile creep deformation of bulk Sn-3.8Ag-0.7Cu solder at temperatures between 263 K and 398 K, covering lifetimes up to 3,500 h, has been rationalized using constitutive equations that incorporate structure-related internal state variables. Primary creep is accounted for using an evolving internal back stress, due to the interaction between the soft matrix phase and a more creep-resistant particle phase. Steady-state creep is incorporated using a conventional power law, modified to include the steady-state value of internal stress. It is demonstrated that the observed behavior is well-fitted using creep constants for pure tin in the modified creep power law. A preliminary analysis of damage-induced tertiary creep is also presented.

Item Type: Journal Article
ISSN: 1743-2847
Keywords: creep; Pb-free solder; constitutive equations
Academic Unit/Department: Mathematics, Computing and Technology > Engineering & Innovation
Item ID: 6957
Depositing User: Martin Rist
Date Deposited: 22 Feb 2007
Last Modified: 02 Dec 2010 19:57
URI: http://oro.open.ac.uk/id/eprint/6957
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