A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules

Terasaki, Nobuyuki; Ohashi, Touyou; Nagatomo, Yoshiyuki; Kuromitsu, Yoshirou and Shirzadi, Amir A. (2019). A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules. Journal of Materials Science: Materials in Electronics, 30(7) pp. 6552–6555.

DOI: https://doi.org/10.1007/s10854-019-00961-6

Abstract

A new method for liquid-phase bonding of copper plates to an aluminum nitride (AlN) substrate was developed in this work. A newly developed proprietary interlayer composed of titanium and silver powders was deposited on the AlN substrate using a screen-printing machine. The eutectic reaction between printed silver and copper at 850 °C led to formation of a liquid phase at the joint interface. A total of 42 samples were prepared using seven and six different amounts of silver and titanium, respectively. The microstructures of all samples were analyzed by scanning electron microscopy and energy-dispersive X-ray spectroscopy, and an ultrasonic flaw detector was used to assess joint integrity. The optimum composition of the Ti–Ag brazing alloy for producing defect-free joints was determined. The formation of a continuous titanium nitride layer was found to be essential for achieving sound joints between the copper plates and AlN substrate.

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