Terasaki, Nobuyuki; Ohashi, Touyou; Nagatomo, Yoshiyuki; Kuromitsu, Yoshirou and Shirzadi, Amir A.
(2019).
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(Accepted Manuscript)
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| DOI (Digital Object Identifier) Link: | https://doi.org/10.1007/s10854-019-00961-6 |
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| Google Scholar: | Look up in Google Scholar |
Abstract
A new method for liquid-phase bonding of copper plates to an aluminum nitride (AlN) substrate was developed in this work. A newly developed proprietary interlayer composed of titanium and silver powders was deposited on the AlN substrate using a screen-printing machine. The eutectic reaction between printed silver and copper at 850 °C led to formation of a liquid phase at the joint interface. A total of 42 samples were prepared using seven and six different amounts of silver and titanium, respectively. The microstructures of all samples were analyzed by scanning electron microscopy and energy-dispersive X-ray spectroscopy, and an ultrasonic flaw detector was used to assess joint integrity. The optimum composition of the Ti–Ag brazing alloy for producing defect-free joints was determined. The formation of a continuous titanium nitride layer was found to be essential for achieving sound joints between the copper plates and AlN substrate.
| Item Type: | Journal Item |
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| Copyright Holders: | 2019 Springer Science+Business Media, LLC |
| ISSN: | 1573-482X |
| Keywords: | liquid-phase bonding; aluminum nitride; insulated gate bipolar transistor |
| Academic Unit/School: | Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation Faculty of Science, Technology, Engineering and Mathematics (STEM) |
| Item ID: | 59278 |
| Depositing User: | Amir Shirzadi |
| Date Deposited: | 01 Mar 2019 16:19 |
| Last Modified: | 29 May 2019 12:59 |
| URI: | http://oro.open.ac.uk/id/eprint/59278 |
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