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Terasaki, Nobuyuki; Ohashi, Touyou; Nagatomo, Yoshiyuki; Kuromitsu, Yoshirou and Shirzadi, Amir A.
(2019).
DOI: https://doi.org/10.1007/s10854-019-00961-6
Abstract
A new method for liquid-phase bonding of copper plates to an aluminum nitride (AlN) substrate was developed in this work. A newly developed proprietary interlayer composed of titanium and silver powders was deposited on the AlN substrate using a screen-printing machine. The eutectic reaction between printed silver and copper at 850 °C led to formation of a liquid phase at the joint interface. A total of 42 samples were prepared using seven and six different amounts of silver and titanium, respectively. The microstructures of all samples were analyzed by scanning electron microscopy and energy-dispersive X-ray spectroscopy, and an ultrasonic flaw detector was used to assess joint integrity. The optimum composition of the Ti–Ag brazing alloy for producing defect-free joints was determined. The formation of a continuous titanium nitride layer was found to be essential for achieving sound joints between the copper plates and AlN substrate.
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About
- Item ORO ID
- 59278
- Item Type
- Journal Item
- ISSN
- 1573-482X
- Keywords
- liquid-phase bonding; aluminum nitride; insulated gate bipolar transistor
- Academic Unit or School
-
Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
Faculty of Science, Technology, Engineering and Mathematics (STEM) - Copyright Holders
- © 2019 Springer Science+Business Media, LLC
- Depositing User
- Amir Shirzadi