Computation of Electromagnetic Field and Complex Materials Interaction

Qin, Rongshan (2018). Computation of Electromagnetic Field and Complex Materials Interaction. Progress In Electromagnetics Research Symposium, 2017(Spring) pp. 862–867.

DOI: https://doi.org/10.1109/PIERS.2017.8261863

URL: http://ieeexplore.ieee.org/document/8261863/

Abstract

We develop a method to calculate the electromagnetic field distribution in complex materials. The system contains multiple phases with different electrical and magnetic properties and also contains multiple components which can diffuse around to affect the local electromagnetic properties. Based on the calculations we are able to determine the interaction between electromagnetic field and materials microstructure and property evolutions. It is possible to use electromagnetic field to drive materials phase and compositions to redistribute. Using the theoretical predictions we have made many novel materials which are not possible to achieve by other conventional method. It is possible to use electromagnetic field to manipulate nano-scale gas bubbles, liquid droplets and solid inclusions in materials matrix.

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About

  • Item ORO ID
  • 52948
  • Item Type
  • Journal Item
  • ISSN
  • 1931-7360
  • Project Funding Details
  • Funded Project NameProject IDFunding Body
    TRANSFER IN: UK Consortium of Mesoscale Engineering SciencesEP/L00030X/1EPSRC (Engineering and Physical Sciences Research Council)
    Study of the Electropulse-based Superclean Steel Green Processing MethodNA150320Royal Society Newton Advanced Fellowship
  • Extra Information
  • ISBN: 978-1-5090-6269-0

    Paper presented at the symposium held 22–25 May 2017, St Petersburg, Russia
  • Keywords
  • force; current; electromagnetics; conductivity; metals; microstructure; electric potential
  • Academic Unit or School
  • Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
    Faculty of Science, Technology, Engineering and Mathematics (STEM)
  • Copyright Holders
  • © [2017] by the Institute of Electrical and Electronics Engineers, Inc.
  • Depositing User
  • Rongshan Qin

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