Development of a novel wafer-probe for in situ measurements of thin film properties

el Otell, Z.; Marinov, D.; Šamara, V.; Bowden, M. D.; de Marneffe, J-F.; Verdonck, P. and Braithwaite, N. St.J. (2015). Development of a novel wafer-probe for in situ measurements of thin film properties. Plasma Sources Science and Technology, 24(3), article no. 032002.

DOI: https://doi.org/10.1088/0963-0252/24/3/032002

URL: http://iopscience.iop.org/article/10.1088/0963-025...

Abstract

We report a new development of a diagnostic technique, referred to as the wafer probe, which enables us to qualitatively monitor the plasma-induced changes in thin film dielectrics, in-situ and in real time. The wafer probe is an adaptation of the well-established ion flux probe technique, also known as RF biased or pulse biased planar Langmuir probe. This technique utilises the top surface of a tile cut from a multi-layer wafer as the probing area. This technique was successfully used to characterise different plasma conditions and monitor the plasma-induced changes in the thin layers of the tile, e.g. a porous organosilicate-glass low-κ dielectrics. The wafer probe was used to monitor the different effects of an argon and a hydrogen plasma on low-κ dielectrics, as well as to monitor the etch rate and endpoint of an Ar/SF6 plasma.

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