Effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2007). Effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect. In: Proceedings of 2007 8th International Conference on Electronics Packaging Technology, IEEE, pp. 1–4.

DOI: https://doi.org/10.1109/ICEPT.2007.4441519

Abstract

Interfacial reactions from high-density electric currents were investigated in a eutectic SnZn solder/Cu interconnect. An abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was thicker than that at the anode. A kinetic model, based on the Zn mass transport in the sample, was presented to explain the growth of the intermetallic compound at the anode and cathode. The back stress induced by electromigration of Sn in the solder interconnect is considered to drive Zn atoms drift to cathode.

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• Item ORO ID
• 41922
• Item Type
• Conference or Workshop Item
• ISBN
• 1-4244-1392-3, 978-1-4244-1392-8
• Project Funding Details

• Funded Project Name	Project ID	Funding Body
  Not Set	Grant No. 50228101	Chinese Natural Science Foundation
  Not Set	Grant No. 2004CB619306.	National Basic Research Program of China,

• Academic Unit or School
• Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
  Faculty of Science, Technology, Engineering and Mathematics (STEM)
• Copyright Holders
• © 2007 IEEE
• Depositing User
• Xinfang Zhang