Abnormal polarity effect of electromigraton on intermetallic compound formation in Sn-9Zn solder interconnect

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2007). Abnormal polarity effect of electromigraton on intermetallic compound formation in Sn-9Zn solder interconnect. Scripta Materialia, 57(6) pp. 513–516.

DOI: https://doi.org/10.1016/j.scriptamat.2007.05.023

Abstract

Interfacial reactions in a eutectic Sn–Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 × 10⁴ A cm⁻² for 166 h, an abnormal “polarity effect” was found where the intermetallic compound layer at the cathode was about 2.3 μm thicker than that at the anode. Upon increasing the temperature to about 185 °C, Cu–Zn compounds were replaced by Cu–Sn compounds at the anode and by a mixture of Cu–Zn and Cu–Sn compounds at the cathode.

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About

• Item ORO ID
• 41919
• Item Type
• Journal Item
• ISSN
• 1359-6462
• Project Funding Details

• Funded Project Name	Project ID	Funding Body
  Not Set	Grant No. 50228101	Chinese Natural Science Foundation
  Not Set	Grant No. 2004CB619306	National Basic Research Program of China

• Keywords
• abnormal polarity effect; electromigration; intermetallic compound
• Academic Unit or School
• Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
  Faculty of Science, Technology, Engineering and Mathematics (STEM)
• Copyright Holders
• © 2007 Acta Materialia Inc. Published by Elsevier Ltd.
• Depositing User
• Xinfang Zhang