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Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization. Journal of Alloys and Compounds, 487(1-2) pp. 776–780.

DOI (Digital Object Identifier) Link: https://doi.org/10.1016/j.jallcom.2009.08.064
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Abstract

Interfacial reactions and growth kinetics of intermetallic compound layers formed between Sn–9Zn solder and electroplated Fe–42Ni metallization were investigated after ageing at 120, 150 and 170 ◦C for up to 360 h. Experimental results show that the intermetallic compound formed at the interface was mainly δ-FeZn8.87 phase, rather than the FeSn2 phase. The reason is that the attraction between Zn and Fe is stronger than that of Sn and Fe. The growth exponent n for δ-FeZn8.87 phase was found to be about 0.5, indicating that it grew by a diffusion-controlled process. The activation energy for the growth of δ-FeZn8.87 phase was determined to be 42 kJ/mol, which is in good agreement with the reported data.

Item Type: Journal Item
Copyright Holders: 2009 Crown Copyright. Published by Elsevier B.V.
ISSN: 0925-8388
Project Funding Details:
Funded Project NameProject IDFunding Body
Not SetGrant No. 2004CB619306National Basic Research Program of China
Keywords: intermetallics; kinetics; interfacial reactions; FeNi; activation energy
Academic Unit/School: Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
Faculty of Science, Technology, Engineering and Mathematics (STEM)
Item ID: 41917
Depositing User: Xinfang Zhang
Date Deposited: 17 Feb 2015 12:32
Last Modified: 04 Oct 2016 11:42
URI: http://oro.open.ac.uk/id/eprint/41917
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