Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization. Journal of Alloys and Compounds, 487(1-2) pp. 776–780.

DOI: https://doi.org/10.1016/j.jallcom.2009.08.064

Abstract

Interfacial reactions and growth kinetics of intermetallic compound layers formed between Sn–9Zn solder and electroplated Fe–42Ni metallization were investigated after ageing at 120, 150 and 170 ◦C for up to 360 h. Experimental results show that the intermetallic compound formed at the interface was mainly δ-FeZn8.87 phase, rather than the FeSn2 phase. The reason is that the attraction between Zn and Fe is stronger than that of Sn and Fe. The growth exponent n for δ-FeZn8.87 phase was found to be about 0.5, indicating that it grew by a diffusion-controlled process. The activation energy for the growth of δ-FeZn8.87 phase was determined to be 42 kJ/mol, which is in good agreement with the reported data.

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