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Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect

Zhang, X. F.; Guo, J. D. and Shang, J. K. (2009). Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect. Journal of Electronic Materials, 38(3) pp. 425–429.

DOI (Digital Object Identifier) Link: https://doi.org/10.1007/s11664-008-0594-1
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Abstract

Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 × 104 A/cm2 for 168.5 h at 150°C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a thicker Cu6Sn5 phase replaced the Ni5Zn21 phase at the Ni/Sn-Zn interface, whereas at the Cu/Sn-Zn interface, a thicker β-CuZn phase replaced the Cu5Zn8 phase.

Item Type: Journal Item
Copyright Holders: 2008 TMS
ISSN: 1743-2847
Keywords: electromigration; coupling effect; polarity; intermetallic compound; interfacial reaction
Academic Unit/School: Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
Faculty of Science, Technology, Engineering and Mathematics (STEM)
Item ID: 41915
Depositing User: Xinfang Zhang
Date Deposited: 12 Feb 2015 10:50
Last Modified: 04 Oct 2016 11:42
URI: http://oro.open.ac.uk/id/eprint/41915
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