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A review of hydrophilic silicon wafer bonding

Masteika, V.; Kowal, J.; Braithwaite, N. St.J. and Rogers, T. (2014). A review of hydrophilic silicon wafer bonding. ECS Journal of Solid State Science and Technology, 3(4) Q42-Q54.

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URL: http://jss.ecsdl.org/content/3/4/Q42
DOI (Digital Object Identifier) Link: https://doi.org/10.1149/2.007403jss
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Abstract

Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer.

Item Type: Journal Item
Copyright Holders: 2014 The Electrochemical Society
ISSN: 1945-7111
Project Funding Details:
Funded Project NameProject IDFunding Body
CASE studentship funded by Applied Microengineering LtdNot SetEPSRC (Engineering and Physical Sciences Research Council)
Academic Unit/School: Faculty of Science, Technology, Engineering and Mathematics (STEM) > Physical Sciences
Faculty of Science, Technology, Engineering and Mathematics (STEM)
Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
Interdisciplinary Research Centre: Centre for Earth, Planetary, Space and Astronomical Research (CEPSAR)
Item ID: 40115
Depositing User: Jan Kowal
Date Deposited: 08 May 2014 08:29
Last Modified: 29 Nov 2016 23:12
URI: http://oro.open.ac.uk/id/eprint/40115
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