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The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers

Masteika, V.; Kowal, J.; Braithwaite, N St.J and Rogers, T. (2013). The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers. Microsystem Technologies, 19(5) pp. 705–712.

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Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length bond strength measurement in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has stopped moving, and that the presence of moisture has a strong positive influence on the rate of crack propagation under static loading. A new Maszara protocol is suggested based on modelling crack growth using our experimentally derived constants.

Item Type: Journal Article
Copyright Holders: 2012 Springer
ISSN: 1432-1858
Project Funding Details:
Funded Project NameProject IDFunding Body
Not SetNot SetEPSRC (Engineering and Physical Sciences Research Council)
Not SetNot SetApplied Microengineering Ltd.
Extra Information: Manuscript number MITE-D-12-02006R2
Keywords: silicon; wafer bonding; humidity; crack propagation; razor blade
Academic Unit/Department: Science > Physical Sciences
Mathematics, Computing and Technology > Engineering & Innovation
Mathematics, Computing and Technology
Interdisciplinary Research Centre: Centre for Earth, Planetary, Space and Astronomical Research (CEPSAR)
Item ID: 35366
Depositing User: Jan Kowal
Date Deposited: 06 Nov 2012 12:05
Last Modified: 23 Feb 2016 21:51
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