Masteika, V.; Kowal, J.; Braithwaite, N St.J and Rogers, T.
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|DOI (Digital Object Identifier) Link:||http://dx.doi.org/doi:10.1007/s00542-012-1685-8|
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Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length bond strength measurement in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has stopped moving, and that the presence of moisture has a strong positive influence on the rate of crack propagation under static loading. A new Maszara protocol is suggested based on modelling crack growth using our experimentally derived constants.
|Item Type:||Journal Article|
|Copyright Holders:||2012 Springer|
|Funders:||EPSRC, Applied Microengineering Ltd.|
|Extra Information:||Manuscript number MITE-D-12-02006R2|
|Keywords:||silicon; wafer bonding; humidity; crack propagation; razor blade|
|Academic Unit/Department:||Science > Physical Sciences
Mathematics, Computing and Technology > Design, Development, Environment and Materials
|Interdisciplinary Research Centre:||Centre for Earth, Planetary, Space and Astronomical Research (CEPSAR)|
|Depositing User:||Jan Kowal|
|Date Deposited:||06 Nov 2012 12:05|
|Last Modified:||16 May 2013 16:23|
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