Masteika, V.; Kowal, J.; Braithwaite, N St.J and Rogers, T.
PDF (Accepted Manuscript)
- Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
Download (535Kb) | Preview
|DOI (Digital Object Identifier) Link:||http://doi.org/10.1007/s00542-012-1685-8|
|Google Scholar:||Look up in Google Scholar|
Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length bond strength measurement in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has stopped moving, and that the presence of moisture has a strong positive influence on the rate of crack propagation under static loading. A new Maszara protocol is suggested based on modelling crack growth using our experimentally derived constants.
|Item Type:||Journal Article|
|Copyright Holders:||2012 Springer|
|Project Funding Details:||
|Extra Information:||Manuscript number MITE-D-12-02006R2|
|Keywords:||silicon; wafer bonding; humidity; crack propagation; razor blade|
|Academic Unit/Department:||Faculty of Science, Technology, Engineering and Mathematics (STEM) > Physical Sciences
Faculty of Science, Technology, Engineering and Mathematics (STEM)
Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation
|Interdisciplinary Research Centre:||Centre for Earth, Planetary, Space and Astronomical Research (CEPSAR)|
|Depositing User:||Jan Kowal|
|Date Deposited:||06 Nov 2012 12:05|
|Last Modified:||04 Oct 2016 18:36|
|Share this page:|
Download history for this item
These details should be considered as only a guide to the number of downloads performed manually. Algorithmic methods have been applied in an attempt to remove automated downloads from the displayed statistics but no guarantee can be made as to the accuracy of the figures.