Kowal, J.; Nixon, T.; Aitken, N. and Braithwaite, N. St. J.
(2009).
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| DOI (Digital Object Identifier) Link: | http://dx.doi.org/doi:10.1016/j.sna.2009.08.018 |
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| Google Scholar: | Look up in Google Scholar |
Abstract
A new method of exposing silicon/semiconductor wafers to a mixture of radicals is described, in which these species are generated in an oxygen-rich gas discharge confined between a concentric pair of annular mesh electrodes surrounding the wafers. This approach allows the wafer surfaces to be treated without damage from the energetic ions, strong electric fields, and high UV fluxes associated with direct treatment by exposure to gas discharge plasmas. The process is compared with direct oxygen plasma activation for its latitude with respect to treatment duration, effect on wafer surface roughness and bond strength. Wider process latitude and reduced surface roughening are obtained for treatment by radicals compared with direct plasma exposure. Comparative analysis of treated and untreated silicon surfaces by X-ray photoelectron spectroscopy indicate that traces of fluorine present on the wafer surface before treatment are removed with great efficiency by the process.
| Item Type: | Journal Article |
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| Copyright Holders: | 2009 Elsevier B.V. |
| ISSN: | 0924-4247 |
| Funders: | UK Department for Trade and Industry |
| Keywords: | wafer bonding; radical; activation; plasma; XPS; surface science; electron spectroscopy; fluorine; silicon |
| Academic Unit/Department: | Mathematics, Computing and Technology > Design, Development, Environment and Materials Mathematics, Computing and Technology > Communication and Systems Science > Physical Sciences |
| Interdisciplinary Research Centre: | Centre for Earth, Planetary, Space and Astronomical Research (CEPSAR) |
| Item ID: | 18380 |
| Depositing User: | Colin Smith |
| Date Deposited: | 08 Sep 2009 14:47 |
| Last Modified: | 10 Dec 2012 13:16 |
| URI: | http://oro.open.ac.uk/id/eprint/18380 |
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