Fitzpatrick, M. E.; Hutchings, M. T.; King, J. E.; Knowles, D. M. and Withers, P. J.
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The effects of a thermal residual stress field on fatigue crack growth in a silicon carbide particle-reinforced aluminium alloy have been measured. Stress fields were introduced into plates of material by means of a quench from a solution heat treatment temperature. Measurements using neutron diffraction have shown that this introduces an approximately parabolic stress field into the plates, varying from compressive at the surfaces to tensile in the centre. Long fatigue cracks were grown in specimens cut from as-quenched plates, and in specimens which were given a stress-relieving overageing heat treatment prior to testing. Crack closure levels for these cracks were determined as a function of the position of the crack tip in the residual stress field, and these are shown to differ between as-quenched and stress-relieved samples. By monitoring the compliance of the specimens during fatigue cycling, the degree to which the residual stresses close the crack has been evaluated.
|Item Type:||Journal Article|
|Academic Unit/Department:||Mathematics, Computing and Technology > Engineering & Innovation|
|Depositing User:||Michael E. Fitzpatrick|
|Date Deposited:||19 Jan 2009 09:09|
|Last Modified:||02 Dec 2010 20:18|
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