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Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly

Kariya, Y.; Gagg, C. R.; Williams, N. and Plumbridge, W. J. (2000). Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly. In: CHANNEL Users Meeting, 15-18 June 2000, Hobro, Denmark.

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Abstract

Abstract not available.

Item Type: Conference Item
Academic Unit/Department: Mathematics, Computing and Technology > Engineering & Innovation
Item ID: 12323
Depositing User: Colin Gagg
Date Deposited: 27 Nov 2008 11:20
Last Modified: 02 Dec 2010 20:15
URI: http://oro.open.ac.uk/id/eprint/12323
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