Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly

Kariya, Y.; Gagg, C. R.; Williams, N. and Plumbridge, W. J. (2000). Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly. In: CHANNEL Users Meeting, 15-18 Jun 2000, Hobro, Denmark.

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