Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly

Kariya, Y.; Gagg, C. R.; Williams, N. and Plumbridge, W. J. (2000). Allotropic transformation study and phase mapping in tin-copper lead-free solder for electronic assembly. In: CHANNEL Users Meeting, 15-18 June 2000, Hobro, Denmark.

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Abstract

Abstract not available.

Item Type:	Conference Item
Academic Unit/Department:	Mathematics, Computing and Technology > Design, Development, Environment and Materials
Item ID:	12323
Depositing User:	Colin Gagg
Date Deposited:	27 Nov 2008 11:20
Last Modified:	02 Dec 2010 20:15
URI:	http://oro.open.ac.uk/id/eprint/12323

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