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Tin pest in lead-free solders

Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J. (2001). Tin pest in lead-free solders. Soldering and Surface Mount Technology, 13(1) pp. 39–40.

DOI (Digital Object Identifier) Link: http://dx.doi.org/10.1108/09540910110361730
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Abstract

Considers the effect of low temperatures on the characteristics of lead-free alloys based upon tin, which is the most popular basis for the new alloys.

Item Type: Journal Article
ISSN: 0954-0911
Keywords: Lead-free soldering; Reliability; Tin;
Academic Unit/Department: Mathematics, Computing and Technology > Engineering & Innovation
Item ID: 12217
Depositing User: Colin Gagg
Date Deposited: 05 Nov 2008 17:49
Last Modified: 02 Dec 2010 20:14
URI: http://oro.open.ac.uk/id/eprint/12217
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