Tin pest in lead-free solders

Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J. (2001). Tin pest in lead-free solders. Soldering and Surface Mount Technology, 13(1), pp. 39–40.

DOI (Digital Object Identifier) Link:	http://dx.doi.org/doi:10.1108/09540910110361730
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Abstract

Considers the effect of low temperatures on the characteristics of lead-free alloys based upon tin, which is the most popular basis for the new alloys.

Item Type:	Journal Article
ISSN:	0954-0911
Keywords:	Lead-free soldering; Reliability; Tin;
Academic Unit/Department:	Mathematics, Computing and Technology > Design, Development, Environment and Materials
Item ID:	12217
Depositing User:	Colin Gagg
Date Deposited:	05 Nov 2008 17:49
Last Modified:	02 Dec 2010 20:14
URI:	http://oro.open.ac.uk/id/eprint/12217

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