Kariya, Yoshiharu; Gagg, Colin and Plumbridge, William J.
|DOI (Digital Object Identifier) Link:||http://dx.doi.org/10.1108/09540910110361730|
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Considers the effect of low temperatures on the characteristics of lead-free alloys based upon tin, which is the most popular basis for the new alloys.
|Item Type:||Journal Article|
|Keywords:||Lead-free soldering; Reliability; Tin;|
|Academic Unit/Department:||Mathematics, Computing and Technology > Engineering & Innovation|
|Depositing User:||Colin Gagg|
|Date Deposited:||05 Nov 2008 17:49|
|Last Modified:||02 Dec 2010 20:14|
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