The Open UniversitySkip to content
 

Tin pest in Sn-0.5 wt.% Cu lead-free solder

Kariya, Yoshiharu; Williams, Naomi; Gagg, Colin and Plumbridge, William (2001). Tin pest in Sn-0.5 wt.% Cu lead-free solder. JOM Journal of the Minerals, Metals and Materials Society, 53(6) pp. 39–41.

DOI (Digital Object Identifier) Link: http://dx.doi.org/10.1007/s11837-001-0101-0
Google Scholar: Look up in Google Scholar

Abstract

Tin pest (the product of the allotropic transformation of β-tin into α-tin at temperatures below 286 K) has been observed in a Sn-0.5 wt.% Cu solder alloy. Some 40 percent of the specimen surface was transformed into gray tin after aging at 255K for 1.5 years, and after 1.8 years, the proportion increased to about 70 percent. The degree of transformation in work-hardened areas is much higher than in other areas, suggesting residual stress might provide an additional driving force for the transformation into α-tin. The allotropic change results in a 26 percent increase in volume, and cracks are initiated to accommodate the changes in volume. Results indicate that tin pest could lead to total disintegration of micro-electronic solder joints. The tin-copper eutectic system may become a prominent lead-free solder, and tin pest could have major ramifications on service lifetime of electronic assemblies.

Item Type: Journal Article
ISSN: 1047-4838
Academic Unit/Department: Mathematics, Computing and Technology > Engineering & Innovation
Item ID: 12207
Depositing User: Colin Gagg
Date Deposited: 05 Nov 2008 18:04
Last Modified: 02 Dec 2010 20:14
URI: http://oro.open.ac.uk/id/eprint/12207
Share this page:

Actions (login may be required)

View Item
Report issue / request change

Policies | Disclaimer

© The Open University   + 44 (0)870 333 4340   general-enquiries@open.ac.uk