Fitzpatrick, M. E. and Edwards, L.
(1998).
| URL: | http://open.library.ingentaconnect.com/content/asm... |
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| DOI (Digital Object Identifier) Link: | https://doi.org/10.1361/105994998770347918 |
| Google Scholar: | Look up in Google Scholar |
Abstract
Residual stress fields are now widely accepted to have significant influence on fatigue crack growth. Tensile stresses have detrimental effects on fatigue lives, whereas compressive residual stresses can be beneficial. Control of fatigue lives via residual stress is now established in many industrial applications, using techniques such as shot peening or cold expansion. However, knowledge of the processes that occur when a fatigue crack grows through a pre-existing stress field is far from complete. Although the residual stress field will clearly have an effect on crack growth, the crack will equally have an effect on the residual stress field. The determination of this effect is not trivial, and direct measurement may be the designer’s best safeguard. This article outlines the complementary effects that a growing fatigue crack and a residual stress field have on each other. Two types of residual stress field are considered: mechanically induced and thermally induced. The results are discussed in terms of the implications that residual stress interactions have for damage-tolerant-based design.
| Item Type: | Journal Item |
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| ISSN: | 1059-9495 |
| Academic Unit/School: | Faculty of Science, Technology, Engineering and Mathematics (STEM) > Engineering and Innovation Faculty of Science, Technology, Engineering and Mathematics (STEM) |
| Item ID: | 11280 |
| Depositing User: | Michael E. Fitzpatrick |
| Date Deposited: | 08 Aug 2008 08:21 |
| Last Modified: | 04 Oct 2016 10:11 |
| URI: | http://oro.open.ac.uk/id/eprint/11280 |
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